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MF084700 - SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques Revision:SEMI MF847-02 - Superseded and electrical properties of leadframe

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Description

and electrical properties of leadframe tape

1-0709 (technical revision)

moisture ingress from non-sealed edge)

Derived from liquid air by fractional distillation

MF084700 - SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques Revision:SEMI MF847-02 - Superseded and electrical properties of leadframeThe orientation of flats on silicon wafers is an important materials acceptance requirement. The flats are used in semiconductor device processing to provide consistent alignment of device geometries with respect to crystallographic planes and directions. The orientation of a wafer flat is the orientation of the surface of the flat (on the edge of the wafer). Flats are usually specified with respect to a low index plane, such as a (110) plane. In such

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